Product

Reflow equipment

PSK Holdings' fluxless reflow equipment, GENEVA, holds high performance, low CoO, compact footprint and eco-friendly process, and is quickly replacing former flux reflow equipment which was applied to early bump reflow process. Marketshare No.1 worldwide GENEVA is one of a kind with field proven stability and quality. It offers a solution to meet customer need such as warpage process, e.g. FOWLP, and high quality product. GENEVA is in a process of development for mass production to apply at bonding reflow process as well as fluxless reflow process, e.g. chip on wafer or solder ball mount.

Product line up
  • Product specification
  • Low CoO & high reliability
  • Small footprint
  • Warpage minimization
  • High productivity
  • High throughput & yield
  • Product specification
  • Low CoO
  • Small footprint with 550mm panel size
  • Warpage minimization
  • Great temperature uniformity
  • High throughput & yield