PSK Holdings' ECOLITE series offer descum and surface treatment for wafer-level or panel-level semiconductor packaging process. Descum is a process to remove scum after lithography, and it is essential to guarantee good profile of RDL pattern and bump shape. Surface treatment is applied to remove residue or metallic ion at pre-film coating and post RDL etch. It allows adhesion improvement of coated film with changing surface roughness and hydrophilic property of base layer.